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Eurostars2 - Búsqueda de centro de I+D especializado en micrófonos MEMS (sistemas microelectromecánicos) piezoeléctricos

Resumen

Tipo:
Búsqueda de socios
Referencia:
RDKR20150826001
Publicado:
03/09/2015
Resumen:
Una empresa coreana especializada en filtros SAW (onda acústica superficial) y módulos de RF (radiofrecuencia) está preparando una propuesta para el programa Eurostars 2, con fecha límite en marzo de 2016. El objetivo es desarrollar micrófonos MEMS (sistemas microelectromecánicos) piezoeléctricos. La empresa busca socios con el fin de desarrollar el sistema microelectromecánico (MEMS) y el circuito integrado de aplicación específica (ASIC). El plazo para presentar expresiones de interés finaliza en enero de 2016.

Details

Tittle:
Eurostars2 - R-Y-D partner sought on piezoelectric MEMS (Micro Electro Mechanical Systems) microphone (Mic)
Summary:
A Korean company specialising in SAW (Surface Acoustic Wave) filters and RF (Radio Frequency) module is preparing a project proposal under the EUROSTARS2 programme with the deadline of March, 2016. The project will focus on developing and commercialising piezoelectric MEMS Mic. They are looking for a partner to design MEMS-Micro Electro Mechanical System and ASIC (Application specific integrated circuit) for Mic.
Description:
This Korean company specialises in the field of tiny packaging such as system in package or flip-chip bonding applicable to mobile and wearable devices. With their competency of the packing technology, they want to broaden their business in acoustics business.

This R-Y-D project is about developing an original technology of piezoelectric MEMS Mic, which can be widely used in the mobile device market such as cell phones, earphones, headphones, wearable devices and so on.

Currently, there is no such technology and no end-product in Korean market. That is why they want to develop and research the technology by expanding their business area. After this R-Y-D project, they will commercialise the end-product with a partner company.

For doing the R-Y-D on this, there are some factors to be needed.
1) MEMS designing and manufacturing
2) ASIC designing and manufacturing
3) Mic package designing, development process and manufacturing
4) Testing and verifying the quality of the Mic package
5) Mass production of the end product
6) Marketing and sales of the product

With a partner, they would like to review the roles according to the each factor mentioned above.
1) MEMS designing and manufacturing : partner(s)
2) ASIC designing and manufacturing : partner(s)
3) Mic package designing, development process and manufacturing : the Korean company
4) Testing and verifying the quality of the Mic package : partner(s) -Y- the Korean company
5) Mass production of the end product : the Korean company
6) Marketing and sales of the product : partner(s) and the Korean company

The final goal to maximize the characteristics of packaging process is supposed to be for flip-chip bonding. However, in the beginning phase of the development, it is possible to research and develop the package process through wire bonding.

The name of the call is "piezoelectric MEMS microphone" and they are looking for a European company which can provide appropriate technologies and carry on the roles mentioned above under the program of Eurostars2. Duration of the R-Y-D is one or two years, but it can be decided with a partner company.
And deadline for the proposal submission is by the beginning of March, 2016. Accordingly, the deadline of the EOI will be about the end of January, 2016.
Advantages and Innovations:
Comparing with the current Mic(capacitive MEMS Mic), the result of the R-Y-D(Piezoelectric MEMS Mic) will
- be very new to market
- be better in performance
- be smaller in size
- have high SNR(Signal-to-Noise Ratio), reliability

(Since it is a new technology, there is no specific size or performance which is quantified)
Stage of Development:
Proposal under development
Technical Specification or Expertise Sought:
Characteristics of the final product will be as followed.

1) Sensitivity : 38dB(decibel)
2) Signal to Ratio =70dB
3) Dynamic range ˜ 110dB
4) AOP(Acoustic Overload point) = 150dB
5) Linear : Wideband 40~20KHz
6) Size
(1) MEMS Size = 1.4 x 1.4mm, 400µm
(2) ASIC Size = 0.5 x 0.5mm, 200µm
(3) Mic package Size = 3.35 x 2.50, 900µm
7) MEMS, ASIC designing process for package development
(1) Flip-chip Bonding
(2) Wire Bonding

Partner sought

Partner Sought:
- Type of partner sought : Companies - Specific area of activity of the partner : Development of electronic circuits, electronic materials and its related manufacturing technologies - Task to be performed : Research and development under the program of EUROSTARS2.
Type of Partnership Considered:
RDR

Client

Type and Size of Client:
Industry 250-499
Already Engaged in Trans-National Cooperation:
No
Languages Spoken:
English

Dissemination

Programme-call