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H2020 - PILOTS-01-2016: Búsqueda de socio industrial para fabricar soluciones de envasado aptas para microondas

Resumen

Tipo:
Búsqueda de socios
Referencia:
RDES20151120001
Publicado:
30/11/2015
Caducidad:
30/11/2016
Resumen:
Un centro tecnológico español busca un fabricante/usuario de soluciones de envasado aptas para microondas, preferiblemente recipientes de cartón. El objetivo es utilizar una planta piloto para el desarrollo de procesos de producción de nuevos materiales con propiedades térmicas y conductoras mediante procesos de impresión 3D-2D. El socio buscado debe demostrar la viabilidad del proceso de fabricación de los nuevos materiales. La fecha límite de la convocatoria es el 8 de diciembre de 2015 y el plazo para presentar expresiones de interés finaliza el 4 de diciembre.

Details

Tittle:
H2020 - PILOTS-01-2016: Industrial partner sought in manufacturing microwable packaging solutions
Summary:
A Spanish technology centre needs an industrial partner: microwable packaging solutions manufacturer/user (preferably in cardboard materials). The aim of the project is to use a pilot plant for the development of manufacturing processes of novel materials with thermal and conductive properties by means of 3D-2D printing processes. They exclusively look for an industrial partner with the role of demonstrating the feasibility of manufacturing the novel materials.
Description:
The project deals with a pilot plant to develop novel materials with thermal and conductive properties by means of 3D-2D printing processes.

The project is going to develop depositions with thermal properties by means of 3D printing processes and electric connections or conductive by means of 2D printing processes.

One application is focused on thermal printing circuits and structures for cooking tops, thermal circuits for coffee making machines, as well as focused heating in washing machines.

3D printing of the metal-polymer circuit, adding laser sintering for the material will be also incorporated on the project. On the thermal material conductive tracks will be printed.

Second application is focused on printing conductive inks as a thermal circuit or susceptor printed on cardboard packaging solutions for heating microwable packaging solutions. Adding laser or heat sintering for the inks will be also considered.

Third application is focused on heat dissipation layer for abrasive materials by means of conductive inks as well being able to print hard structures based on different materials.

They seek a partner capable of manufacturing/using microwable packaging solutions (preferably in cardboard materials). And the role to be accomplished is to demonstrate the application developed during the project and focused on printing conductive inks as a thermal circuit or susceptor printed on cardboard packaging solutions for heating microwable packaging solutions. Adding laser or heat sintering for the inks will be also considered.

CALL DEADLINE: 8th December.
EOIs DEADLINE: 4th December.
Stage of Development:
Proposal under development

Partner sought

Partner Sought:
The partner sought is a manufacturer/user of microwable packaging solutions (preferably in cardboard materials). The role of the partner sought is to demonstrate the application developed during the project and focused on printing conductive inks as a thermal circuit or susceptor printed on cardboard packaging solutions for heating microwable packaging solutions. Adding laser or heat sintering for the inks will be also considered.
Type of Partnership Considered:
RDR

Client

Type and Size of Client:
R-Y-D Institution
Already Engaged in Trans-National Cooperation:
Si
Languages Spoken:
English
Spanish

Dissemination

Programme-call

Evaluation Scheme:
Innovation Action
Anticipated Project Budget:
-Y-euro;4-6Million
Coordinator Required:
No
Deadline for Call:
08/12/2015
Project Duration:
130