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A French SME developing silicon photonic circuits with integrated lasers at wafer-level is looking for partners in high-speed optical communication and Lidar applications to reach technical or research cooperation agreements

Resumen

Tipo:
Oferta Tecnológica
Referencia:
TOFR20200113001
Publicado:
20/01/2020
Caducidad:
05/04/2020
Resumen:
The SME develops silicon photonic integrated circuits (IC). Their solution increases energy efficiency, enables an extensive integration of active and passive optical components, while significantly reducing main costs.
They are currently taking their silicon photonic IC technology to an industrial level, and they are looking for advanced collaboration with partners from optical communications or Lidar applications sectors under research/technological agreements. H2020 calls are targeted.

Details

Tittle:
A French SME developing silicon photonic circuits with integrated lasers at wafer-level is looking for partners in high-speed optical communication and Lidar applications to reach technical or research cooperation agreements
Summary:
The SME develops silicon photonic integrated circuits (IC). Their solution increases energy efficiency, enables an extensive integration of active and passive optical components, while significantly reducing main costs.
They are currently taking their silicon photonic IC technology to an industrial level, and they are looking for advanced collaboration with partners from optical communications or Lidar applications sectors under research/technological agreements. H2020 calls are targeted.
Description:
Created in 2018 and based in France, the company´s main activity is the design of photonic IC, combining the best of Silicon (Si) and Indium Phosphide (InP) materials using wafer-scale bonding of InP on Si.

Their technology draws upon over 15 years of research in InP/Si lasers, silicon photonics, and 3D packaging carried out at CEA-Leti, a leading technological institute in France.

Intra datacenters interconnections are currently supported by optical transceivers with speed of 100Gbit/s moving to 200Gbit/s.

Based on demonstrators manufactured in the research fab, the company develops the technology to support speeds up to 800Gbit/s; hence improving performance, but also reducing the form factor, the power consumption, and the assembly costs. Plus, the solution is scalable to 1.6TBits/s to cope with the always increasing switching capability of ethernet to reach 51.2Tbit/s in 2023.

They secured an agreement with commercial silicon foundry to build industrial prototypes of fully integrated photonic circuits (comprising multi-wavelength lasers, waveguides, wavelength filters, and photodetectors). Those prototypes will be tested in the second half of 2020.

They are looking for partners in optical communications or Lidar applications sectors to help them scale-up/build prototypes dedicated to new applications under research or technological agreements. They plan to participate in H2020 program, especially these calls related to photonics and Big data :
- DT-ICT-04 Photonics Innovation Hubs (call deadline April 22)
- ICT-36 Disruptive photonics technologies (call deadline April 22)
- ICT-37 Advancing photonics technologies and application-driven photonics components and the innovation ecosystem (call deadline 22)
They are also investigating the possibility of participating in EUREKA calls (Eurostars + EURIPIDES /PENTA).

Expressions of interest are welcome until April 6.
Advantages and Innovations:
Technology benefits:

An unmatched level of integration, reducing assembly costs, and improving performance:
- Laser (No alignment of lasers needed)
- Silicon Optical Amplifier leveraging the material gain available on-chip
- High speed modulators InP/Si modulators (0.5V.cm - 13dB/cm)
- Co-integration with high-speed Electronic IC

Leverage on the latest silicon photonics process evolution at foundries such as availability of:
- Germanium (Ge) for efficient photodetector
- Silicon Nitride (SiNx) for improved passive devices (filters, surface couplers from the fiber to the chip) insensitive to temperature changes

Scalable to photonic interposer with a simplified fabrication process.
Stage of Development:
Under development/lab tested
IPs:
Design Rights,Granted patent or patent application essential,Exclusive Rights
CommeR Statunts Regarding IPR Status:
They have a license agreement covering patents and know-how with CEA-Leti. Some patents are with exclusive rights.

Partner sought

Type and Role of Partner Sought:
The French company wants to collaborate with partners from the optical communications industry (device manufacturers, network operators) or companies developing Lidar, or sub-systems, targeting autonomous vehicle or industrial applications.
Partnerships with R-Y-D Institutions and Universities are of interest only in the framework of H2020 or Horizon Europe collaborative projects.
The role of the partner would be to co-specify the photonics IC for the targeted application and integrate the product for system-level testing for addressing new applications under research or technological cooperation agreements.

Client

Type and Size of Client:
Industry SME <= 10
Already Engaged in Trans-National Cooperation:
Si
Languages Spoken:
English
French

Dissemination

Restrict dissemination to specific countries:
Belgium, Canada, China, Denmark, Finland, Germany, Greece, Iceland, Ireland, Israel, Italy, Japan, Korea, Republic Of, Netherlands, Norway, Poland, Singapore, Spain, Sweden, Switzerland, Taiwan, Province Of China, United Kingdom, United States

Keywords

Technology Keywords:
01002001 Micro and Nanotechnology related to Electronics and Microelectronics
01002007 Nanotechnologies related to electronics & microelectronics
01002008 Optical Networks and Systems