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Disipador térmico basado en nanocomposite polimérico para dispositivos electrónicos

Resumen

Tipo:
Oferta Tecnológica
Referencia:
TOSG20190108005
Publicado:
13/02/2019
Caducidad:
14/02/2020
Resumen:
Un instituto de investigación singapurense ha desarrollado un disipador térmico basado en el uso de un nanocomposite polimérico conductor de calor. Este disipador ofrece una alta conductividad térmica y resistencia mecánica y eléctrica. El nanocomposite polimérico es una alternativa eficaz a los metales empleados en la fabricación de disipadores térmicos. El nuevo disipador es ligero y resistente a la corrosión, puede ser moldeado por inyección e integrarse fácilmente en varios componentes de un dispositivo o sistema electrónico. Además puede utilizarse en carcasas de dispositivos y baterías de alta potencia, componentes estructurales de aviones y automóviles, tuberías, conductos y contenedores en aplicaciones offshore y de petróleo y gas. El instituto busca pymes de cualquier tamaño y multinacionales con el fin de establecer acuerdos de licencia.

Details

Tittle:
Polymeric nanocomposite-based heat sink for electronic devices
Summary:
A Singapore academic and research institute has developed a heat sink using a thermally conductive polymeric nanocomposite material. The heat sink has high thermal conductivity, mechanical strength, and electrical resistance.

The institute is seeking partnerships with all sizes of SMEs and MNEs through technology licensing agreements.
Description:
The institute has developed the heat sink by employing widely used cost-effective thermally conductive polymeric nanocomposite material that can be easily injection-molded to various shapes and sizes.

The polymeric nanocomposite material can be considered as an effective alternative to metals used for the manufacture of conventional heat sinks; the resultant heat sink is lightweight in nature and resistant to corrosion. It also exhibits electrical insulation properties and high mechanical strength. The heat sink developed using the polymer is injection moldable and can be easily integrated with several parts of an electronic device or system.

Apart from its use as a heat sink for electronic devices, it has potential use in device casings, high-power battery casings, aircraft and automobile structure components as well as pipes, tubes, and containers in marine, off-shore, and oil and gas applications.

The heat sink, fabricated using the polymer exhibits thermal conductivity that is significantly higher than the currently available heat sinks in the market.

The institute seeks licensing agreements with MNEs and SMEs of all sizes.
Advantages and Innovations:
The heat sink can be easily fabricated using standard processing and molding techniques and does not require specialized processes, thereby reducing production costs. The material used allows for design flexibility, ease of fabrication, and formulation; besides, it has a controlled percolation threshold.

It also exhibits enhanced thermal stability, high electrical and thermal conductivity (around 10 times higher than currently used ones) and tunable properties that help in enhancing design flexibility and meeting specific end-product requirements.

The developed polymeric nanocomposite and the heat sink are better alternatives to metal-based heat sinks for various component and product developers in the electronic and manufacturing industries.
Stage of Development:
Field tested/evaluated
IPs:
Other
CommeR Statunts Regarding IPR Status:
Know-how developed by the Singapore institute.

Partner sought

Type and Role of Partner Sought:
The Singapore institute seeks to partner SMEs of all sizes and MNEs in the form of a licensing agreement where the partner can license the technology and incorporate it into its applications.

The partner can be product developers or manufacturers of electronic devices or components.

Client

Type and Size of Client:
R&D Institution
Already Engaged in Trans-National Cooperation:
Si
Languages Spoken:
English

Keywords

Technology Keywords:
02007014 Plastics, Polymers