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Empresa coreana ofrece una tecnología de fabricación de enchufes de prueba durante el procesamiento de semiconductores back-end mediante el uso de láser de alta precisión

Resumen

Tipo:
Oferta Tecnológica
Referencia:
TOKR20160822001
Publicado:
07/09/2016
Caducidad:
07/09/2017
Resumen:
Una pyme coreana especializada en soluciones de prueba para cualquier tipo de paquete de semiconductores ofrece enchufes de prueba para procesamiento de semiconductores back-end. La tecnología se emplea para separar artículos defectuosos de productos finales. La soluciones mejoran la resistencia a la humedad, pudiéndose aplicar en electrónica de automoción, etc., y también reducen los costes de fabricación. La empresa busca socios con el fin de establecer acuerdos de comercialización, joint venture o cooperación técnica.

Details

Tittle:
A Korean SME is offering a manufacturing technology of test sockets during back-end semiconductor processing utilizing high-precision laser technology
Summary:
A Korean SME focusing on providing test solutions for all semiconductor packages is offering test sockets for back-end semiconductor process. It is used when sorting defective goods from end products. They improve resistance to moisture so it can be applied to automotive electronics etc. Also they can reduce the manufacturing cost. The SME is looking for partners available for commercial agreement or joint venture or technical cooperation.
Description:
According to the rising demand of internet of things(IoT) and wearable devices, semiconductor post process test socket market is expected to grow up. The global semiconductor market is estimated to be worth USD 472 billion by 2018. The Korean test socket market is estimated to be worth 270 billion KRW as of 2016.
As semiconductor manufacturing technologies have advanced, packages have become miniaturized so there is a high need for the fine pitch test sockets in internet of things(IoT), wearable devices, and automotive semiconductor markets.

The offered technology provides :
- A cost effective test sockets by selecting the silicone pin method with laser technology, as opposed to the previous spring method which requires manual work.
- It improves poor tolerance to moisture by supplementing the silicone.
- With the laser cutting technology, the realization of fine pitch(less than 0.3mm) is possible.
- Wafer marking technology with femto-second laser, the realization of fine pitch package process.
- Test socket could be applied for the interposer technology.

The SME is interested in a commercial agreement, joint venture or technical cooperation with partners partners who are selling semiconductor information and communications technology (ICT) test sockets, who are foundries or manufacturers (OEMs), or who need semiconductors for vehicles and ultra-precision memory semiconductors.
Advantages and Innovations:
Advantage -Y- Innovation
- Competitive price comparing with pogo pin and pressure sensitive conductive rubber(PCR)
- Resistant to moisture
- High conductance
- Laser cutting technology making fine pitch(less than 0.4mm) without manual work
- The initial resistance value: ¿100m-Y-omega;
- The current rating: ¿2A
- The maximum life cycle: ¿50,000 (Depend on pitch)
- Coverage-temperature: -40¿ ~140¿
Stage of Development:
Already on the market
IPs:
Secret Know-how,Patent(s) applied for but not yet granted,Granted patent or patent application essential,Trade Marks
CommeR Statunts Regarding IPR Status:
7 Patents are granted in Korea.
Other patents and certificates are applied but not yet granted in Korea and Europe etc.

Partner sought

Type and Role of Partner Sought:
- Type of partner sought: companies
- Specific area of activity of the partner : Foundry or manufacturers etc.
- Task to be performed : Commercial agreement, joint venture or technical cooperation ideally with distributors/agents who are selling semiconductor ICT test sockets, foundries, manufacturers (OEMs), or those who need semiconductor for vehicle, ultra-precision memory semiconductor.

Client

Type and Size of Client:
Industry SME 11-49
Already Engaged in Trans-National Cooperation:
No
Languages Spoken:
English

Keywords

Technology Keywords:
02007005 Composite materials
02005003 Empaquetado de maquinaria
01002007 Nanotechnologies related to electronics & microelectronics
09006001 Normas de calidad
09006002 Normas técnicas