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Método de envasado hermético para dispositivos SOI-MEMS con pasacables verticales

Resumen

Tipo:
Oferta Tecnológica
Referencia:
TOTR20161031009
Publicado:
12/06/2017
Caducidad:
12/06/2018
Resumen:
Un investigador turco ha desarrollado un método de envasado hermético para dispositivos SOI (silicio sobre aislante) - MEMS (dispositivos microelectromecánicos) con pasacables verticales. La tecnología permite el empaquetado de microestructuras a nivel de oblea y la formación de pasacables verticales en una sola oblea de SOI que necesitan encapsularse en una cavidad hermética. Este método de envasado hermético consume menos material y conlleva menos pasos que otras técnicas. El investigador busca agentes comerciales o distribuidores interesados en licenciar la tecnología.

Details

Tittle:
Hermetic packaging method for soi-mems devices with vertical feedthroughs
Summary:
A Turkish resarcher has invented a hermetic packaging method for SOI ( Silicon on Insulator) - MEMS (Microelectromechanical Systems ) devices with vertical feed throughs. With this technology, wafer-level packaging of microstructures as well as vertical feedthroughs formed on a single SOI wafer that need to be encapsulated in a hermetic cavity. The researcher is looking for potential agencies or distrubutors who will be interested in licensing the technology.
Description:
Wafer level packaging of microstructures increases the fabrication yield, decreases the package size as well as the cost and as a result they become useful in a wide range of applications. This invention provides a novel packaging method suitable with the SOI ( Silicon on Insulator) fabrication processes and done by using a single SOI ( Silicon on Insulator) wafer completely different than the other techniques in the world. In this invention, a SOI wafer containing both microstructures and vertical feedthroughs is bonded to a cap wafer by using silicon-metal based alloys or silicon-glass anodic bonding techniques for the hermetic packaging of microstructures. The formation of vertical feedthroughs on the same SOI ( Silicon on Insulator) wafer with the microstructures without requiring any complex drilling/filling process allows this hermetic packaging method to be done with reduced material usage and process steps compared to the other methods in the literature.

The researcher is looking for potential clients who will be interested in licensing the technology so that the partner either can be agencies or distributors under licencing opportunity conditon that makes researcher´s technologies to has a wide partner perspective. This technology has novel packaging method which is unique technique in the world so that clients will have matchless technology.
Advantages and Innovations:
A wafer-level packaging method for SOI-MEMS structures that are desired to be encapsulated in a hermetic cavity and that need the transfer of at least a single or multiple electrical leads to the outside of the cavity without destroying the hermeticity of the cavity.

Compared to existing techniques, main advantages can be specified as;

-Wafer-level-packaging: Packaging of all microstructures on an SOI wafer at the same step

-Hermetic: Packaging of microstructures under desired environmental conditions

-Vertical-feedthroughs: Leads of the microstructures formed on the same SOI wafer with microstructures are vertically transferred to the outside of the package

-Low cost: Reduced material usage and process steps compared to the other techniques in the literature

-Compatibility: Packaging with or without any sealing material at low or moderate temperatures
Stage of Development:
Prototype available for demonstration
IPs:
Granted patent or patent application essential
CommeR Statunts Regarding IPR Status:
PCT application is pending

Partner sought

Type and Role of Partner Sought:
The researcher is looking for potential clients who will be interested in licensing the technology so that the partner either can be agencies or distributors under licencing opportunity conditon that makes researcher´s technologies to has a wide partner perspective.

Client

Type and Size of Client:
University
Already Engaged in Trans-National Cooperation:
No
Languages Spoken:
English

Keywords

Technology Keywords:
01002003 Electronic engineering
01002001 Micro and Nanotechnology related to Electronics and Microelectronics
01006003 Mobile Communications
01002007 Nanotechnologies related to electronics & microelectronics