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Nueva tecnología para placas de circuito impreso que operan a altas temperaturas

Resumen

Tipo:
Oferta Tecnológica
Referencia:
TOUK20151105001
Publicado:
23/11/2015
Caducidad:
22/11/2016
Resumen:
Un estudiante de doctorado de una universidad británica está desarrollando una nueva generación de placas de circuito impreso capaces de funcionar a temperaturas muy elevadas. La nueva tecnología permite mejorar el rendimiento y eficiencia de componentes electrónicos en aplicaciones dentro de los sectores aeroespacial, de automoción, petróleo y gas. El concepto básico puede adaptarse a materiales más económicos, como Ni, Bi, Sn y Cu, y sistemas SLID (Single-Line Injection Device). El procesamiento sencillo no requiere aplicar ninguna presión en la matriz durante la sinterización. Se buscan socios industriales y académicos con el fin de establecer acuerdos de cooperación en materia de investigación.



Details

Tittle:
New technology for high temperature electronic circuit boards
Summary:
A UK University PhD student is developing a new generation of electronic circuit boards capable of functioning at very high temperatures.

The new technology will enable electronic components within applications ranging from aerospace, automotive, oil and gas sectors to significantly improve their performance and efficiency.

Industrial and academic partners are sought for a research cooperation agreement.
Description:
The UK university is looking for research cooperation partners to help them test an innovative solution to enable electronic circuit boards to operate at very high temperatures.

The design takes advantage of solid-solid inter-diffusion bonding utilizing silver nano-particles and gold mesh inter-poser.

The result is a die that attaches during assembly with a continuous, non-porous gold-silver inter-diffusion layer running all the way from the die to the substrate.

The processing of these assemblies is simple and does not require any applied pressure on the die. These assemblies resisted degradation to shear strength for at least 1000h storage at 450 °C and at least 100h storage at 600 °C.

The random porosity of standard pressure-free sintered silver die attach is converted into single voids at the centre of each mesh cell and can be controlled by the mesh geometry.

The UK university is interested in academic or industrial organisations interested in developing the new high temperature electronic circuit board as a collaborative research project.
Advantages and Innovations:
There is growing interest in solutions for attaching wide-band gap semiconductor die to substrates in order to manufacture functional electronics for applications where the temperature at the die exceeds 300 °C.

Two examples of applications for such high temperature electronics are deep oil and gas exploration, and power semiconductors devices, in which operating temperatures of more than 400 °C may be required.

The major advantage of this system is the interaction at the interface between sintered silver and gold has been utilized to design a die attach for high temperature applications that is thermally stable i.e. does not degrade at high temperatures.

The main advantages include:

· Increase of time or temperature does not weaken the die attach.
· Unique ability to place stress relief voids at critical areas and low porosity at other areas to optimize strength/co-efficient thermal expansion (CTE) mismatch trade-offs.
· It can help the EU to get one step closer to achieving completely environmentally friendly electronic equipment, e.g. lead-free.
· Potential for adapting the basic concept for use with cheaper materials such as Ni and Bi, or Sn and Cu.
· Simple processing that does not require any applied pressure on the die during sintering.
· Potential for adapting the concept for use in improved Single-Line Injection Device (SLID) systems.
Stage of Development:
Under development/lab tested
IPs:
Secret Know-how,Patent(s) applied for but not yet granted

Partner sought

Type and Role of Partner Sought:
The UK university is looking for research partners to help them test the innovative technology solution for operating electronic circuits at very high temperatures.

Potential partners could be other universities with an interest and funding settlement available to develop state-of-the-art engineering solution that could then be used in high value industries such as aerospace, automotive, oil and gas.

Industrial partners from the aforementioned sectors would also be considered as potential partners, commercial actors would gain a competitive advantage by developing high performance solutions for high temperature problems related to electrical engineering.

Client

Type and Size of Client:
University
Already Engaged in Trans-National Cooperation:
Si
Languages Spoken:
English

Keywords

Technology Keywords:
02002006 Endurecimiento, tratamiento térmico
02002016 Microingeniería y nanoingeniería
05001005 Petroquímica, ingeniería del petróleo
02007015 Properties of Materials, Corrosion/Degradation
02002002 Recubrimientos