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Sistema en módulos soldable para aplicaciones integradas


Oferta Tecnológica
Una empresa checa tiene amplia experiencia en fabricar sistemas en módulos soldables para aplicaciones integradas. La solución se basa en un sistema en chip o sistema en módulos con microcontrolador ARM Cortex y FPGA (Field-programmable gate array). Las principales ventajas incluyen las posibilidades ilimitadas del software, alta configurabilidad y colocación y soldadura sencillas. La empresa busca socios internacionales con el fin de establecer acuerdos de cooperación y comercialización con asistencia técnica.


Solderable system-on-module for embedded applications
A Czech company with long tradition manufactures solderable system-on-module for embedded applications. Main advantage is unlimited software possibilities, high configurability and easy board placement and soldering. The company is looking for international partners for a commercial agreement with technical assistance or a technical cooperation agreement.
As the electronic systems integration degree grows, the demands on the production technology get higher and higher. Pitch reduction and circuits encapsulation almost excludes usage of one or two-layer printed circuit boards and production at semi-professional workplaces. But even fully professional products get considerably more expensive if a simple board needs to be controlled by a micro-controller unit.

The solution is a use of modules integrating all components requiring high precision, leaving the motherboard as simple as possible. Such solution is offered by the Czech company - a solderable system-on-module for embedded applications. The solution offered is based on system-on-chip or system on module with ARM Cortex microcontroller and also with Field-programmable gate array (FPGA). Quick and easy development is ensured by a standard connector. All this is compressed on a 16 cm2 only with various software possibilities.

The module is placed on a thin ledge allowing the parts placement on both sides. Together with a high degree of integration it minimizes the module size, giving also an option to use the surface of motherboard for other (hidden) components. Rapid simplification of the motherboard circuits leads to usability of cheaper production technology and hence a significant price cut. The module is intended to be soldered directly on the board using RIM connector, providing various ways of assemblage - pin header connector (dismountable), half-round connection (solderable), RIM connector (solderable) and surface-mount technology (solderable).

RIM connector allows users to multiple connect one printed circuit board to another one without connectors or wires because the board has small holes on its rim, which allows easy soldering (hence RIM connector).

The solution of solderable system-on-module for embedded applications offered is suitable for critical applications affected by vibrations, chemicals, temperature fluctuations and so on. There is no need to change this solderable system-on-module when switching from a prototype production to a mass production.
The applications are especially effective in small-series products requiring high computing power or powerful microprocessor, respectively. Such applications might be electric engine control, custom-made mobile instruments (e.g. for healthcare sector), instruments for flammable environment etc.

For instance, the solderable system-on-module has been already used in an outdoor charging station for electromobiles.

Main competing advantage is ability of the company to design and deliver embedded applications and solutions as a one-stop-shop: a complex of software and hardware solution including manufacturing, assembly and tests based on a customer needs in-house in one place.

The company is looking for international partners for a commercial agreement with technical assistance - the company manufactures and delivers solution with all technical assistance (such as software, installation etc.) necessary.
The second possible cooperation form is technical cooperation agreement - the company designs, develops and manufactures desired embedded solution specified by the client.
Advantages and Innovations:
- motherboard simplification with two-layer-only boards
- save time, space and money
- high configurability processor module
- easy board placement and soldering
- cheaper solution for small batches
- smaller consumption of precious metals (the layer of gold etc. could be thinner than usual)
- solderable module offered has higher reliability than standard connectors thanks to better heat conductivity
- easier development of custom printed circuit board thanks to various way of assemblage
- quick start software development
- single voltage supply 3,3 V to 5, 5V
- additional circuits stacking possibility - e.g. LCD connector, analog-digital and digital-analog converters etc. (solderable directly on the module),
- the way to decrease the size of the motherboard since other components can be hidden under the module.
Stage of Development:
Already on the market
Secret Know-how

Partner sought

Type and Role of Partner Sought:
Companies or research institutes interested in development of embedded applications using this solderable system-on-module based on a commercial agreement with technical assistance - the company manufacture and deliver solution with all technical assistance (such as software, installation etc.) necessary.

Companies wishing to develop embedded applications and willing to adapt this module to its specific needs based on a technical cooperation agreement - the company designs, develops and manufactures desired embedded solution specified by the client.


Type and Size of Client:
Industry SME <= 10
Already Engaged in Trans-National Cooperation:
Languages Spoken:


Technology Keywords:
01002003 Electronic engineering
01002004 Embedded Systems and Real Time Systems
02009008 Sistemas de navegación y sistemas integrados