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Tecnología de unión con películas conductoras anisotrópicas de dispositivos electrónicos mediante vibración con ondas ultrasónicas

Resumen

Tipo:
Oferta Tecnológica
Referencia:
TOKR20160809001
Publicado:
11/08/2016
Caducidad:
11/08/2017
Resumen:
Una pyme coreana está especializada en materiales y equipos de unión con películas conductoras anisotrópicas (ACF) mediante vibración con ondas ultrasónicas. Esta tecnología se utiliza para unir componentes electrónicos y evitar los daños causados por la unión por termocompresión, garantizando una adhesión rápida y segura de los componentes. La empresa busca socios en el sector de unión de componentes electrónicos de dispositivos inteligentes (tarjetas inteligentes, dispositivos portátiles, pantallas digitales, etc.) con el fin de establecer acuerdos de comercialización o joint venture.


Details

Tittle:
Technology for ACF bonding between electrical devices using ultrasonic wave vibration.
Summary:
A Korean SME active in providing process technology, materials and equipment related to ultrasonic anisotropic conductive film (ACF) bonding and packaging materials is introducing their ACF technology. This is used for bonding between electronics parts without any damages caused by thermo-compression bonding. This guarantees fast and highly reliable connection among electronics parts. The SME is looking for a partner for available for commercial agreement or joint venture.
Description:
As of 2015, according to the rising demand for smart devices, the global anisotropic conductive film (ACF) market is estimated to be worth over 700 million euro and the ACF bonding equipment market is estimated to be worth over 400 million euro.

One of the conventional technologies to bond electronics parts is thermos-compression method using externally applied heat. However this SME which is developing new materials and ultrasonic ACF technology offers the new method using ultrasonic waves which generates heat voluntarily and internally.
The thermos-compression method usually damages the film due to the heat obtained externally. However this SME uses the latter method specifically using vertical ultrasonic vibrations. This enables ACF heat up to 300 ¿ itself without any damage and still maintain the temperature of bonding horn at room temperature.
As a result, it is free from heat loss or damage caused by outside heat as well as reducing bonding time up to 1 sec, also it can be applied for fine pitch (<48-Y-micro;m)patterns

The SME is looking for partners in the field of bonding electronics parts in various smart devices such as smart cards, wearable devices, digital information display(DID) etc. for commercial agreement or joint venture.
Advantages and Innovations:
- No heat loss or heat damage of film because external heat sources are not transferred
- Fast(min.1sec) and highly reliable connection(no bending and no misconnection) can be established.
- Great fine pitch(<48-Y-micro;m) pattern response
Stage of Development:
Already on the market
IPs:
Patents granted

Partner sought

Type and Role of Partner Sought:
- Type of partner sought: Companies
- Specific area of activity of the partner: In the field of bonding electronics parts in various smart devices such as smart cards, wearable devices, DID(Digital Information Display etc.)
- Task to be performed: Commercial agreement or joint venture

Client

Type and Size of Client:
Industry SME <= 10
Already Engaged in Trans-National Cooperation:
No
Languages Spoken:
English

Keywords

Technology Keywords:
01001001 Automation, Robotics Control Systems
01002001 Micro and Nanotechnology related to Electronics and Microelectronics
02002016 Microingeniería y nanoingeniería
01002007 Nanotechnologies related to electronics & microelectronics
01002012 Semiconductores